Semiconductor Weekly | 20221025

1. The USITC voted to launch a patent infringement investigation against Samsung Electronics, Qualcomm and TSMC with respect to certain semiconductordevices and integrated circuits and mobile devices using these components.


2. Intel CEO: Willing to work for AMD and NVIDIA to include their own chips in foundry performance.


3. U.S. chipmaker Broadcom will apply to EU antitrust regulators for early approval for its $61 billion acquisition of cloud computing company VMware, citing competition from Amazon, Microsoft and Google.


4. The 28nm 12-inch wafer fab, a joint venture between Hon Hai and Vedanta, is planned to be put into operation in 2025. The initial output wili be 40,000wafers per month, and full-speed production will begin the following year.


5. EU countries want the European Chip Act to fund cutting-edge chip production.


6.The US FCC plans to ban Huawei and ZTE from selling new communication equipment in the US.


7. Samsung plans to use BSPDN technology to develop 2nm chips that can develop the back of the wafer.