Semiconductor Weekly | 20230905

1. TheElec reported on August 30 that Samsung Electronics disclosed the research results of high-bandwidth memory (HBM)-processing memory (PIM) and LPDDR-PIM in Hot Chips 2023. According to Samsung Electronics, if HBM-PIM is applied to generative AI, the performance and power efficiency of the processor will be more than 2 times higher than that of the existing HBM.


2. The Financial Associated Press reported on August 30 that Nvidia and Google Cloud announced the expansion of their partnership to promote the development of artificial intelligence computing, software and services. It is reported that Google's new supercomputer A3 GPU configured with Nvidia H100 GPU will be widely available in September.


3. Nikkei reported on August 30 that the latest statistics from the Semiconductor Manufacturing Equipment Association of Japan (SEAJ) pointed out that Japanese chip equipment sales in July 2023 were 280.041 billion yen, a year-on-year decrease of 12.6%, the largest decline in the past four years. . Compared with June 2023, sales increased by 8% month-on-month, which was the first time in four months to show a positive month-on-month growth. During the period from January to July 2023, sales of chip equipment in Japan were 2,115.857 billion yen, a slight decrease of 0.9% year-on-year, the second highest in history for the same period.


4. Morgan Stanley’s latest report states that Nvidia believes that TSMC’s CoWoS production capacity will not limit H100 GPU shipments in the next quarter, and supply is expected to increase every quarter next year. At the same time, TSMC raised the CoWoS price by 20% for urgent orders, which also indicates that the CoWoS bottleneck is expected to ease.


5. Science and Technology Board Daily News on August 22, Intel is building the latest packaging plant in Penang, Malaysia, to strengthen the layout of 2.5D/3D packaging. The company said it aims to quadruple its 3D Foveros packaging production capacity from current levels by 2025. Robin Martin, vice president of Intel, also revealed in an interview today that the new factory in Penang will become the company's largest 3D advanced packaging base in the future.


6.eeNews August 23, market research agency Gartner said that the chip market for executing artificial intelligence (AI) workloads is growing at a rate of more than 20% per year. Market analysts predict that the AI chip market will reach US$53.4 billion in 2023, an increase of 20.9% over 2022, and 25.6% in 2024, reaching US$67.1 billion. By 2027, AI chip revenue is expected to more than double the size of the market in 2023, reaching $119.4 billion.