Semiconductor Weekly | 20231031

1. Reuters reported on October 31 that ON Semiconductor announced its third quarter results for fiscal year 2023: third quarter revenue was US$2.1808 billion, a year-on-year decrease of 0.54%; net profit attributable to the company was US$582.7 million, a year-on-year decrease of US$582.7 million. to $311.9 million. By business unit, automotive business revenue hit a record, up 33% year-on-year to US$1.2 billion; industrial chip revenue increased 0.4% year-on-year to a record-breaking US$615.8 million.


2. Sina Technology reported on October 31 that the non-profit organization Voltage Park purchased Nvidia chips worth US$500 million and planned to lease computing power to other companies for use in AI projects. The organization is funded by cryptocurrency billionaire Jed McCaleb. Voltage Park CEO Eric Park revealed in an interview that the organization has 24,000 NVIDIA H100 chips and plans to establish NVIDIA AI chip clusters in Texas, Virginia, and Washington, and fully deploy these 24,000 NVIDIA chips in February.


3. Taiwan Business Times reported on October 31 that NVIDIA plans to launch the AI accelerator card GB200 (B100) in 2024 and has now entered the supply chain certification stage. Foxconn is actively seeking orders for B100 accelerator cards and plans to become the second supplier of B100 substrates. However, according to sources, due to factors such as yield rate, NVIDIA decided to supply 100% of its substrates from Wistron in the early stages of mass production of the B100 accelerator card.


4. Financial News Agency reported on October 31 that Apple released a new MacBook Pro, equipped with M3 series chips. Among them, MacBook Pro equipped with M3 Pro and M3 Max will have a new space black color. The new 14-inch and 16-inch MacBook Pro start at US$1,599 and US$2,499 respectively.


5. BusinessKorea reported on October 18 that Samsung Electronics has confirmed that its HBM3E product will be named "Shinebolt". According to industry sources, Samsung is sending HBM3E product Shinebolt samples to customers for quality certification testing. The sample is an 8-layer 24-gigabit chip, and it is said that the development of 12-layer 36-gigabit products will be completed soon. Shinebolt's maximum data transfer speed (bandwidth) is about 50% higher than HBM3, reaching 1.228 terabytes (TB).


6. Yonhap News Agency reported on October 18 that Hyundai Motor and Kia said that they signed a strategic cooperation contract for power chips with German semiconductor giant Infineon Technologies. Infineon will provide some of the power chips required for the production of electric vehicles, hybrid vehicles and other vehicles to the two companies by 2030.